Process Description

Mobile
Cold
Finishing of Coatings
Low Porosity
Gold Plating
Good Adhesion
Exact Thickness
Surface Treatment
Selective

Selective plating is an advanced, well-engineered and complete method of selectively electroplating localised areas without having to use an immersion tank.

Electrolytic cleaning of the surface.
Etching and activating of the surface, or just activating in one or several steps.
The surface is now ready to plate. Normally a bonding layer with a thickness of 2,5 micron is deposited. Then the chosen build-up metal is plated.

To supply the wrapped anode with sufficient quantity of metal solution a pump is used. Therefore the plating can go on without interruption until calculated thickness is obtained. Movement between the anode and the workpiece is needed. The movement varies between 3-15m/min depending of which metal solution is used.

Factors such as desired hardness, corrosion resistance, wear protection and thickness guide to the choice of metal solution.

ADVANTAGES

Mobile, portable equipment for work on-site.
Cold process, no thermal distortion of the base material.
Layers up to 0,2 mm can be plated direct to the right tolerance without any subsequent finishing.